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X-ray technology plays a crucial role in the field of electronic manufacturing. It is widely used for various applications, including quality control, failure analysis, and inspection of electronic components and assemblies. Here are some specific areas where X-ray is applied:

Component Inspection:

X-ray inspection is used to examine electronic components such as integrated circuits (ICs), printed circuit boards (PCBs), connectors, and solder joints. It helps identify defects like cracks, voids, misalignments, and soldering issues that may affect the functionality and reliability of the components.

BGA Inspection:

Ball Grid Array (BGA) packages are commonly used in electronic devices. X-ray inspection allows manufacturers to verify the integrity of the solder balls beneath the package, ensuring proper connections and avoiding issues like shorts or open circuits.


bga inspection

bga inspection

Wire Bonding Inspection:

X-ray technology is used to inspect wire bonding in semiconductor devices. It helps detect issues like wire bond defects, such as missing or misaligned wires, excessive bonding material, or improper connections.

PCB Inspection:

X-ray inspection is employed to examine the internal layers of PCBs, ensuring proper alignment, registration, and integrity of the conductive traces, vias, and solder joints. It helps identify defects like shorts, opens, voids, and delamination.

Counterfeit Detection:

X-ray inspection is used to identify counterfeit electronic components. By examining the internal structure and comparing it with genuine components, X-ray technology can reveal discrepancies such as different die sizes, wire bonding inconsistencies, or hidden markings.


Failure Analysis:

X-ray analysis is an essential tool in failure analysis investigations. It helps identify the root cause of failures, such as solder joint fractures, wire bond failures, or delamination, by providing detailed images of the internal structure of electronic components.

3D Inspection:

X-ray computed tomography (CT) is used to create 3D images of electronic assemblies. This technique allows for non-destructive inspection, enabling manufacturers to analyze the internal structure, measure dimensions, and detect defects in complex assemblies.

Overall, X-ray technology in electronic manufacturing provides valuable insights into the quality, reliability, and functionality of electronic components and assemblies, helping manufacturers ensure high-quality products and improve production processes.